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    Current Position:Home > En > Service > Guide >
    Guide   Problem      Data   
     
     
     1. HiTransferTM AlSiC series

     HiTransferTM  AlSiC Based Material Properties   

     
     
    Properties 
    AlSiC-7 
    AlSiC-9
    AlSiC-11 
    Thermal Conductivity (25°C) 
    W/m·K 
    180 
    180 
    175 
    CTE (25~125°C)  
    ×10-6/K 
    7.2 
    9.3 
    11.2 
    Density, g/cm3
    3.01 
    2.93 
    2.89 
    Young’s Modulus, GPa 
    195 
    175 
    172 
    Flexural Strength, MPa 
    405 
    390 
    383 
     


    2. AlSiC products design guidelines  
    (1) Main features of AlSiC material  
    l         Adjustable coefficient of thermal expansio: can well matched with semiconductor chip materials such as Si、GaAs、AlN;
    l         High thermal conductivity: much higher than Kovar, can spread heat efficiently
    l         Low density: much lower than W/Cu、Mo/Cu and Kovar, can greatly reduce weight
    l         High specific Young’s Modulus: 4 times of Kovar and W/Cu, 2 times of Mo/Cu.
     
    Comparison of properties of AlSiC and other thermal management materials
     
    AlSiC 
    Kovar 
    Cu/W(15/85) 
    Cu/Mo(15/85) 
    Copper 
    Al 
    CTE
    ×10-6 /K
    4.8-16
    5.9
    7.2
    7
    17
    24
    Thermal Cond.(W/m·K) 
    132-255
    14
    190
    160
    400
    210
    Density 
    (g/cm3)
    2.77-3.1 
    8.1 
    17 
    10 
    8.9 
    2.70 
    Specific 
    Stiffness 
    (GPa·cm3/g)
    38-108
    16
    16
    28
    5
    26
     

     (2) Size and shape tolerance of machined AlSiC component  

     
     We can machine AlSiC components including plates and housings by means of various machenical methods such as milling, grinding, drill and EDM. The size and shape tolerance is as follows:
    l         flatness: ³0.05mm (100mm)
    l         size tolerance: ±0.02mm (max)
    l         surface finish: ³1.6mm
    l         hole diameter: F³0.3mm
    l         internal radius: R³1.0mm
    l         inside edge break radius: R³0.1mm
    l         thread hole: M³3.0mm

        
    thread hole  
    internal radius

    3. Main features of Harvest technologies and products

     
     (1) high strength SiC preform preparation technique
    By use of specially designed inorganic binder, the prepared SiC preform has a high strength up to 20MPa (three-point bending), which can withstand the high pressure during infiltration process.
    (2) high reliable and efficient vacuum aid pressure infiltration technique
    The process of aluminium molten liquid infiltrating into the porous SiC preform has been elaborately designed to achive high reliability and efficiency. The adoption of high vacuum and gas pressure technique makes the infiltrated AlSiC composites highly uniform, densified and strengthful.
    (3) High precision machining technique
    AlSiC components are machined using ordinary equipment, specially designed tools and optimized parameters. The size and shape tolerance can well meet the various types of packaging applications.
    (4)High-quality AlSiC Cladding Technique
    AlSiC surface can be electroless plated with Ni-P, Au coating which can meet the 400ºC, 10min, or 420ºC, 5min high-temperature test requirement.